Temperature detection and control

ABSTRACT

A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

CROSS-REFERENCE TO RELATED APPLICATION

Pursuant to 35 U.S.C. § 371, this application is a United StatesNational Stage Application of PCT Patent Application Serial No.PCT/US2019/016811, filed on Feb. 6, 2019, the contents of which areincorporated by reference as if set forth in their entirety herein.

BACKGROUND

Printers and printer cartridges can use a number of technologies toconvey ink or other fluids to a medium. The fluid may be applied to amedium using a device affected by temperature differences across thedevice. Print quality can be determined in part by the outcome of aprint job matching the input the printer is instructed to print. Printcomponents of this disclosure may include applications for 2D and 3Dprinting, as well as other high precision fluid dispensing devices forlaboratory, medical, pharmaceutical, life sciences and other appliances;any fluids or agents used in these applications; and integrated circuitsto expel or propel these fluids, amongst others.

DESCRIPTION OF THE DRAWINGS

Certain examples are described in the following detailed description andin reference to the drawings, in which:

FIG. 1 is a block diagram of an example print component integratedcircuitry package for thermal sensing and control;

FIG. 2 is a block diagram of an integrated circuitry layout;

FIG. 3 is a block diagram of an example of an integrated circuitry frontview;

FIG. 4 is a block diagram of an example printer circuit diagram;

FIG. 5 is a flowchart of an example method for temperature sensing in anintegrated circuitry; and

FIG. 6 is a block diagram of an example printer component layout.

DETAILED DESCRIPTION

Printing devices can generate heat during operation. Thermal printcomponents may operate through the heating of ink or other fluid to pushink out of a nozzle and onto a page, using heater resistors adjacentthese nozzles. The heat generated can be transferred to the printingdevice itself causing temperature on the die to vary. The temperature ofthe printing device can affect the way the printing device operates. Forexample, the temperature of a print head die, or, more generally, thetemperature of the integrated circuitry to actuate and deliver thefluid, can affect the size, speed, shape, and volume of fluid deliveredby the printing device over a set period of time.

The heat generated through the printing process can be unevenlydistributed along the printing device. For example, nozzles in theintegrated circuitry of a printing device may be warmed or heated byheated fluid passing through. The temperature of the integratedcircuitry may vary based on a number of factors including die size, thenumber of nozzles in an area, the distance between nozzles, the distancebetween nozzles and the edges of the integrated circuitry, the shape anddimensions of the integrated circuitry and assembly, and the printingpattern in use, among others.

Thermal ink jet printing can be sensitive to operating temperature. Onedegree of variation can lead to ˜1% difference in ink drop weight, andthe human eye can perceive differences on the order of 2-3%. For low endprinting applications, a single print pen is scanned multiple timesacross a page to form the full printed image. At the intersection of oneswath and the next print swath, an imaginary boundary is formed wherethe dots above the boundary are printed by nozzles on the bottom end ofthe print pen and the dots below the boundary are printed by nozzles onthe top end of the print pen. If temperature control varies greatlyacross the print pen nozzle swath, a human perceivable line or “band” isformed leading to poor print quality. This is due to the variation inejected drop size corresponding to the temperature differences betweenthe two ends of the printing die and more specifically at least twodifferent nozzles on different ends of the die having a variation intemperature. For this reason, managing temperature in multipletemperature zones is key to enabling print quality. To address this thepresent techniques regard a shared “sense” bus that may enable multipleprint die for multiple colors, for example, K, C, M, Y, and multiplediodes per die associated with temperature zones to be multiplexed andmeasured externally through this shared analog bus.

When the printing device uses thin or narrow silicon die, there is lesssilicon to conduct heat and thereby maintain a constant temperaturealong the die. The long end zones of thinner narrower die act as largeareas to cool die ends. These two characteristics make a thin or narrowdie more susceptible to temperature variation than a thick or wide die.In order to overcome this, the present techniques relate to a multi-zonethermal control system.

Driver circuits for managing temperature differences between multiplezones may be located on or off die. The desire to achieve the use of lowcost drivers, can involve relocating complex analog control circuitryoff die during production. This move in the location of the analogcontrol circuitry can increase the interconnect challenge for a systemattempting to address multiple sensors, however it is contemplated inthe scope of these techniques. Another technique includes using a globalanalog sensor bus that is common between die connecting through a sensorpad per die that enables multiplexing on die and between die. Throughthis multiplexing, the multiple temperature zones may be coordinatedoff-die thereby enabling more complex algorithms to improve thermaluniformity on die. Improved thermal uniformity helps eliminate printartifacts during printing.

In an example, there may be three thermal zones per die. In an example,there may be more than three zones or less than three zones per die. Ineach of these zones, there may be an independent temperature sensor. Foreach die, there may also be one or more heating elements. There may bemore heating elements. There may be pulse warming on the silicon die.The temperature sensors and heating elements may be controlled byexternal application-specific integrated circuit (ASIC) through amultiplexed sense bus. The thermal zones may be monitored over time. Thethermal zones may also be monitored at a specific frequency, e.g. thefrequency of printing divided by the number of temperature sensorsconnected to the sense bus.

The protocol for checking temperature and adjusting heat using theshared sense bus for all sensors follows a sense protocol. In anexample, the sense protocol can be multiplexed in-situ while printingusing the thermal ink jet printing protocol. In an example, this meansthe maximum sense rate is a function of the print frequency, the numberof sensors on the bus, and the sequence in which these sensors arecycled.

Use of heating elements in the die end zones can reduce the temperaturedifferential in the nozzle array and thereby improve print quality. Inan example, the temperature differential across the nozzle array can bereduced from 10C to 2-3C. The reduction in temperature differentialreduces the banding seen when the ends of a die differ in temperaturefrom the middle portions of a die.

When a thermal ink jet nozzle is printing a drop of fluid, heat isdissipated at the location of that nozzle. Some of that heat isconducted into the die, causing an increase in temperature. In anexample, a die of smaller mass can be more susceptible to rapidtemperature fluctuations during print density transitions. In the endzones there are no nozzles directly applying heat, so that the greatestsource of heat that raises the temperature of the end zones is thatwhich is conducted through the die from the printing zone. In an exampleof a thin or narrow die, conduction of heat to the end zones isconstrained by the small cross section. This constraint, in combinationwith the absence of nozzles in the end zones, and end zones that arelarge for holding multiplexing or other components, can put the die athigher risk for poor thermal uniformity center to end. Heat is conductedout of a print head through heat transfer when ink flows through thefeed slot and nozzles. Additionally, heat transfer may occur throughthermal conductivity of materials such as silicon. Furthermore, thecompound, such as epoxy, used to embed the silicon slivers also conductsheat, and is a contributing factor in the heat loss increasing theresulting thermal gradients on die. These modes of heat transfer areaspects of the print die can contribute to heat loss, and if notaccounted for, degraded print quality and banding. The temperaturedifferential across the area of the die is increased due to the warmingeffects from field effect transistors and resistor heating occurringnear the center of the print die. By adding warming elements to areasmost affected by heat loss, a large temperature differential across thedie can be reduced. The areas often needing warming are often the dieends as these ends are further away from a higher density of fieldeffect transistors and other resistor heating occurring in the middle ofthe die. Further, the smaller the die is in mass, the more susceptiblethe die will be to rapid temperature fluctuations during print densitytransitions. The techniques shown use die with relatively smaller massto previous print die. These thinner die increase the thermal resistanceto maintaining and achieving equilibrium between the center and end ofdie. Further, the thinner print die often have elongated end zones inorder to preserve total circuit area in order to accommodate the samecircuitry plus any additional multiplexing circuitry or othercomponents. These elongated end zones can hold down end zone temperaturebecause they have no heat input from fluidic actuators. As noted above,the location of the fluidic actuators corresponds to the locations ofthe nozzles. End zones, and more so elongated end zones, do not includethese heat generating devices. As such, these areas and the ink nozzlesclosest to these end zones have a lower temperature when compared to azone in the middle of the print die.

The placement of heating elements and sensors can affect the efficacy ofend warming. For example, the improper placement of sensors and heatersrelative to nozzles will result in poor thermal uniformity across thenozzle swath. For example, if the sensor were on the opposite side ofthe end-most nozzle from a heating element on the end of a die, theheater would continue heating past the point of thermal uniformitybecause the temperature adjustment would reach the sensor after it hadreached nozzle. Similarly, if the sensor is closer to the heatingelement than the nearest nozzle, then the heating sensor may detect anequilibrium temperature prior to the target temperature being reached bythe nearest nozzle that is in the area targeted for heating.

FIG. 1 is a drawing of an example replaceable print head cartridge 100.The drawing includes and excludes components in order to provide contextto show the techniques.

The print component integrated circuitry package 100 may be housed ordisposed on a printer cartridge casing 102 or other removable orrefillable printing mechanism. The printer cartridge includes a sensorpad 104 to detect signals from an integrated circuitry 106. As describedherein the sensor pad 104 enables using a common analog bus tointerconnect multicolor silicon dies mounted in a polymeric mountingcompound, such as an epoxy potting compound. In an example, theintegrated circuitry is a silicon print die. In an example, theintegrated circuitry 106 can be a body of silicon including an array ofprint nozzles. The printer cartridge casing 102 can include a number ofdiscrete units of integrated circuitry where each corresponds to adifferent color. Alternatively, a printer cartridge casing 102 may havea single fluid deploying unit for integrated circuitry 106. Theintegrated circuitry 106 can be conductive for electrical signals.

Signals going to or from the integrated circuitry 106 may be transmittedfrom the sensor pad 104 to a print control contact 108 which maycommunicate electronically with a component in physical contact with theprint control contact 108. The signals transmitted can originate fromsensors on the integrated circuitry 106. In an example, the sensors onthe integrated circuitry are temperature sensors 110 that detect thetemperature of a region on the integrated circuitry 106. Each discreteintegrated circuitry component can have a single temperature sensor 110or a number of temperature sensors 110. The temperature sensors 110 maybe disposed across the integrated circuitry 106 in order to observe thetemperature across different physical regions of the integratedcircuitry 106. The different physical regions of the integratedcircuitry 106 can correspond to temperature regions. Temperature regionsare regions through which heat may travel differently or the temperatureof the region may be affected differently from other regions due to thedimensions, characteristics, and components in the region. Thetemperature region of the temperature sensor 110 can be an end region orthe middle region of the integrated circuitry 106. The end region may bea region defined such that the end region is closer to an edge of theintegrated circuitry 106 than to a middle region of the integratedcircuitry 106. In an example, the end region may be a continuous spacetaking up one tenth of the length of the integrated circuitry 106. Themiddle region may be located in the middle of the integrated circuitry106. The middle region may extend to include a symmetrical orasymmetrical surrounding area around the middle of the integratedcircuitry 106. The middle region may be one tenth the length of thelongest edge of the integrated circuitry 106. The middle region may bethe same size as the edge region.

There may be a number of temperature sensors 110 and a first temperaturesensor can be located in a first region of integrated circuitry 106 anda second temperature sensor 110 can be located on a second region of theintegrated circuitry 106. These regions may be on the same integratedcircuitry 106 or separate and distinct integrated circuitry 106. Thefirst region of integrated circuitry 106 can provide a first color suchas black, red, yellow, or blue and the second region of integratedcircuitry provides a second color, such as cyan, magenta, yellow, andblack. The first region of integrated circuitry for which temperature issensed may be located in a first print pen holding the printer cartridgecasing 102 and the second region of integrated circuitry 106 may belocated in a second print pen holding another cartridge. The connectionof multiple temperatures sensors 110 across multiple integratedcircuitry 106 that may or may not be in the same print pen or for thesame color increases the importance of the sensor pad 104 to multiplexsignals appropriately to and from print controller contact 108.

In an example, an analog sense bus can be conductively connected to thenumber of temperature sensors 110 and the sensor pad 104. In an example,the sensor pad 104 is an external sensor pad that is external in thatthe sensor pad 104 is located on an external face of the printercartridge casing 102. The sensor pad 104 may connect to a correspondingprint controller contact 108. The sensor pad may also multiplex signalstraveling to the number of temperature sensors 110 from the printcontroller contact 108. The temperature sensors 110 may be connected toa single sensor pad 104. The sensor pad 104 can transfer signals fromthe temperature sensors 110 to a corresponding print controller contact108. In an example, the temperature sensors 110 return a signal to theexternal sensor pad 104 in response to an instruction for the integratedcircuitry 106 to print. In this example, the signal request for theintegrated circuitry 106 to print also includes instructions for thetemperature sensors 110 to detect the temperature in the region they arelocated and report the detected temperature to the sensor pad 104. Inorder to accomplish a single signal arriving at the external sensor pad104 at a time, the signals are multiplexed from each of their respectivesources based on information delivered in a data packet to thecomponents on the integrated circuitry 106. For example, selection bitscan be included in a data packet, such as a fire pulse group. Selectionbits may indicate, to components on the integrated circuitry, whichthermal sensor to select. A selected thermal sensor may also be giveninstructions regarding the steering and timing of its signal to arriveat the external sensor pad 104. The use of selection bits coordinated tothe fire pulse group allows multiplexing on the die among the componentsof the die. These selection bits may enable the signal from each thermalsensor to be steered at an appropriate time towards the external sensorpad so that the outgoing signal from the sensor pad 104 may be a singlestream of output rather than a stream for each temperature sensor 110.

In an example, the frequency at which signals are returned to the sensorpad 104 to be sent to the print controller contact 108 is at the rate ofthe integrated circuit print rate divided by the number of thetemperature sensors 110. Using an integrated circuit print rate dividedby the number of temperature sensors 110 can be tied to read offfrequency of each sensor because the print data may specify a singletemperature sensor 110 to be read for each print command. A singletemperature sensor 110 can be identified, e.g. through a selection bitincluded in the data, in a print command to the integrated circuitry106. The integrated circuitry 106 selects the appropriate temperaturesensor or sensors to be multiplexed onto the external pad, where thetemperature sensors communicate a voltage representative of temperature.The voltage measurement of the temperature sensor can be calibrated tocorrespond to a different temperature reading based on calibrations donelocally or remotely and programed into the integrated circuitry 106. Thetemperature sensor 110 selected rotates among the number of temperaturesensors 110 on the printer cartridge casing 102. In one example, thenumber of temperature sensors 110 provide a signal one after the otheralong the shared analog sense bus to the external sensor pad 104 withoutrepeating until each of the temperatures sensors 110 has provided thesignal carrying the detected temperature. In an example, thespecifically selected temperature sensor is controlled by the changingof a bit value in a control register disposed on the integratedcircuitry 106. The control register may be located in a memory circuitof the integrated circuitry 106 that can be located either on or off theintegrated circuitry.

FIG. 2 is a block diagram of an integrated circuitry layout 200. Likenumbered items are as described with respect to FIG. 1.

The integrated circuitry layout 200 can include memory circuitry thatstores data received in a signal from a single analog bus. Theintegrated circuitry layout 200 can be part of a replaceable print headcartridge that includes a single contact pad located on the exterior ofthe replaceable print head cartridge. The integrated circuitry layoutcan host components responsive to signals from the single contact padthat is to communicate stored data from the single lane analog-bus to anumber of temperature sensors on the integrated circuitry 106. Theintegrated circuitry 106 can include a heating element 202 that canprovide heat to the integrated circuitry attached to the heating element202. An end region temperature sensor 204 may be located on the endregion 206 along with the heating element 202. There may be a nozzlearray 208 that includes a number of nozzles in the nozzle array 208 thatalign in a nozzle line. The area on the integrated circuitry past thelast nozzle on the end of the nozzle line may indicate the beginning ofthe end region 206. The end region 206 in some examples may includeportions of the integrated circuitry in the area surrounding a number ofnozzles closest to the end region.

The end region 206 can include a heat element 202 mounted on the face ofthe integrated circuitry intended to be directed towards the printmedium on which ink is delivered. In another example, the heat element202 can be mounted on the face of the integrated circuitry 106 closestto the print cartridge relative to the medium which will be printed on.The end region temperature sensor 204 may be able to detect thetemperature over a period of time to determine the effects of theheating element on the temperature of the integrated circuitry in andnear the end region 206.

The single contact pad of the integrated circuitry layout 200 can beconductively coupled to a number of temperature sensors in order tomultiplex data going to and coming from the number of temperaturesensors. The number of temperature sensors includes the end regiontemperature sensor 204, where each temperature sensor is disposed in anumber of temperature regions including the end region 206 on anintegrated circuitry 106. The temperature sensors can return a signal tothe single contact pad in response to an instruction for the integratedcircuit to print. The print signal may include an indication of aspecific temperature sensor which should detect the temperature andreturn the voltage representative of the detected temperature inresponse to a print command sent to the nozzles. In an example, thesingle contact pad of the integrated circuitry can multiplex signals ata frequency of an integrated circuit print rate divided by the number oftemperature sensors. Temperature sensing bandwidth and operation cantake into account the physical time it takes for a temperature change topropagate along the length of silicon from heat source to sensor. Thisallows consideration of the optimal position and placement of heatersand sensors relative to the nozzle locations.

In order to ensure that the temperature sensor is representative of thenozzle temperature, in an example, D3 roughly equals D1 which roughlyequals D2, where D1 210 is the distance between the end regiontemperature sensor 204 and the nearest nozzle, D2 212 is the distancebetween the nearest nozzle and the heating element 202, and D3 214 isthe distance between the temperature sensor 204 and the heating element202. In an example, the arrangement is to ensure D2 212 is greater than˜100 um. In an example, D3 214 is less than or equal to ˜500 um.

FIG. 3 is a block diagram of an example of an integrated circuitry frontview 300. Like numbered items are as discussed above regarding FIG. 1and FIG. 2.

In the front view shown in FIG. 3, length and width are drawn, withlength being assigned to the largest measured dimension of theintegrated circuit, and the width being the measurement drawn that isperpendicular to the axis of the length. While a front view is shown inFIG. 3, if a side view were being shown, the length and height would bedrawn, with height being along the axis typically measured thicknesses.If an end view were shown, width and height would be drawn.

The integrated circuitry front view 300 includes an approximateddemarcation between an end region 206 and a middle region 302 of theintegrated circuitry. As before, the integrated circuitry 106 can be asilicon print die through which ink may flow. The integrated circuitryfront view 300 shows that the integrated circuitry may be longer thatits width which is shown in FIG. 3 and is perpendicular to the length ofthe integrated circuitry. The orientation shown in FIG. 3 shows that theend regions 206 are located on the ends or distal regions of theintegrated circuitry. The integrated circuit may have a length, width,and height dimension. As the end regions 206 are located on oppositedistal sides of the length of the integrated circuitry, the end regionsmay be the regions that are furthest away from each other. In an exampleeach end region may include the entire width and height of theintegrated circuitry and only a portion of the length of the integratedcircuitry. In this example, the end region 206 may be one tenth of thelength of the integrated circuitry. The end region 206 may be less thanone twentieth of the lengths of the integrated circuitry. The end region206 may be less than one fifth the length and more than one twentieth ofthe length of the integrated circuitry.

The middle region 302 may be the region of the integrated circuitry notconsidered an end region 206 of the integrated circuitry. In an example,each end region and the middle region have one temperature sensor 110each. The middle region 302 may include the height and width of theintegrated circuitry and four fifths of the length of integratedcircuitry. In an example, the middle region 302 may be more than ninetenths the length of the integrated circuitry.

The location of temperature sensors across the middle region 302 andeach end region 206 enable the detection of temperature differencesduring printing. These temperature differences if unaccounted for, canalter the way fluid such as ink is delivered to the medium and affectoverall print quality. To reduce the impact of temperature variationacross the integrated circuit, the number of temperature sensors 110enable measurements of temperature in various temperature regions, e.g.end region 206 and middle region 302. Using this information, heatingelements may be used in the end regions to raise the temperature of theend region 206 to match the temperature detected from the middle region.

FIG. 4 is a block diagram of an example printer circuit diagram 400.Like numbered items are as described with regard to FIG. 1.

The printer circuit diagram 400 includes a single lane analog sense bus402 to electrically connect each of the temperature sensors 110 togetherto report temperatures to the sensor pad and then print controllercontact 108. Instruction may also be delivered to each of thetemperature sensors 110. Each one of the temperature sensors 110 cancorrespond to either an end or middle region of an integrated circuitry106. As shown in FIG. 4, one implementation of the temperature sensors110 includes a dual diode stack set to have a sensing range with aspecific output range for voltage in response to a current supplied tothe temperature sensor 110.

Each temperature sensor 110 can be controlled by a corresponding controlbit 404. The control bit 404 may be modified when a particulartemperature sensor 110 should sense and report a temperature for itscorresponding region. The control bit 404 may be checked each time thereis a print signal. A control bit 404 may be used for a temperaturesensor 110 or a condition circuit 406 located in the integratedcircuitry 106. In an example, the condition circuit 406 may detectanother physical condition other than temperature for the integratedcircuitry 106. The analog sense bus 402 may be connected to a currentsource 408 that supplies current for each of the control bits 404, thetemperature sensors 110, and the condition circuit 406. This current isanalog and the responses from the temperature may also be conveyed usinganalog signals sent to an analog to digital converter 410. In anexample, the analog to digital converter may be located on theintegrated circuitry 106 or may be located off of the integratedcircuitry 106.

FIG. 5 is a flowchart of an example method 500 for temperature sensingin an integrated circuit. While shown in a specific sequence, the methodmay repeat or start at a different point in the sequence.

At block 502, the method 500 includes sending a request for atemperature data response from a number of temperature sensors disposedin a number of temperature regions on an integrated circuitry. In anexample, the integrated circuitry is a silicon print die. A firsttemperature sensor of the number of temperature sensors may be locatedon a first silicon print die and a second temperature sensor of thenumber of temperature sensors can be located on a second silicon printdie.

At block 504, the method 500 includes multiplexing responses from thenumber of temperature sensors at an external sensor pad disposed on theintegrated circuitry, the responses received on a shared, single laneanalog bus.

FIG. 6 is a block diagram of an example printer component layout 600.Like numbered items are as discussed above with regard to FIG. 2.

The printer component layout 600 is shown for a print component 602. Inan example, the print component 602 can be the integrated circuitry 106seen in FIGS. 1 and 2. In an example, the print component 602 may bematerial other than circuitry to enable the placement and layout ofsubcomponents shown.

The print component 602 can include a nozzle array 208. The nozzle array208 shown here is one example of a number of nozzles aligned in a nozzlearray. Other configurations and numbers of nozzles are contemplated. Theprint component 602 includes a heating element 202 and an end regiontemperature sensor 204. The heating element 202 can be used tocounteract any end region temperature deficiency relative to thetemperature detected for a middle region of the print component 602. Inan example, the heating element 202 may be controlled by a print datapacket that controls which thermal sensor is selected.

In order to determine the temperature of the end region, the end regiontemperature sensor 204 is used. The end region temperature sensor 204collects temperature data over time. The collection of temperature datacan be used to identify when an end region temperature is deviating fromthe temperature of another region of the print component. The collectionof temperature data can be used to identify when an end regiontemperature has been warmed by a heating element 202 and when the endregion is warm relative to a target temperature.

The end region may begin in an area that relates to the end-most nozzlesin the nozzle array 208. The nozzles in the nozzle array 208 may form aline by their position. A nozzle array 208 with nozzles not in a linemay instead have nozzles grouped closer to one another than to one ofthe edges of the print component 602.

To provide another frame of reference for understanding the placement ofthese nozzles, consider the direction of travel of a print component 602moving in sweeping motions back and forth across a print medium. In thisexample, as the print component 602 moves to print, the length of theprint component is the dimension running roughly perpendicular to thedirection of travel of the print component and roughly parallel to theprint medium. On either ends of this length of the print components arethe end regions which can include the nearest nozzle 604. The nearestnozzle 604 uses the end region temperature sensor 204 and the heatingelement 202 as items to which the nozzles are most nearly located. Thenearest nozzle 604 may also be nearer to the edge of the lengthwisedimension than other nozzles on the print component 602.

The distance between the nearest nozzle 604 and the end regiontemperature sensor 204 is considered the first distance 608. Thedistance between the nearest nozzle 604 and the heating element 202 isthe second distance 610. The distance between the heating element 202and the end region temperature sensor 204 is the third distance 612.

A print component can include a nozzle array, a temperature sensordisposed on the print component a first distance from the nearest nozzle604 in the nozzle array. The print component can also include a heatingelement disposed on the print component a second distance from thenearest nozzle in the −nozzle array. The third distance between thetemperature sensor and the heating element may be less than the sum ofthe first and second distance, and where the third distance is greaterthan or equal to the smaller of the first distance and the seconddistance. In an example, the nearest nozzle in the nozzle array, thetemperature sensor, and the heating element are equidistant from eachother. The temperature sensor may be closer to the heating element thanit is to the nearest nozzle in the nozzle array.

The nozzle array may be disposed on an external face of the printcomponent that is intended to address a print medium. The temperaturesensor may be located closer to three edges of the external face of theprint component than to the edge of a nozzle. The heating element may belocated in alignment with the nearest nozzle and a second nozzle in thenozzle array. In an example, the first distance is greater than ˜100micrometers. In an example, the third distance can be less than 501micrometers. An end region may be defined as starting at an edge of anearest nozzle, where a heating element is located closer to the edge ofthe nearest nozzle than to a second nearest nozzle. The heating elementmay be located on the integrated circuitry to raise the temperature onan end region to match a temperature detected from a temperature sensordisposed in a middle region of the integrated circuitry.

In an example, a memory circuit can be associated with a replaceableprint head cartridge. The replaceable print head cartridge can include atemperature sensor disposed on the print component a first distance froma nozzle on a silicon die, and a heating element disposed on the silicondie a second distance from the nozzle. As discussed above, the thirddistance between the temperature sensor and the heating element may beless than the sum of the first and second distance, and where the thirddistance is greater than or equal to the smaller of the first distanceand the second distance. The nozzle, the temperature sensor, and theheating element are roughly equidistant from each other. Roughlyequidistant can refer to the first, second, and third distances beingthe same distance within a deviation measurement. As used herein, adeviation measurement can be equal to the diameter of a nozzle, theheight, width, or length of the heating element, the height, width, orlength of the temperature sensor. As used herein, the height, width, andlength measurements may be taken according to the same orientationconventions established in the discussion section of FIG. 3.

While the present techniques may be susceptible to various modificationsand alternative forms, the techniques discussed above have been shown byway of example. It is to be understood that the techniques are notintended to be limited to the particular examples disclosed herein.Indeed, the present techniques include all alternatives, modifications,and equivalents falling within the scope of the following claims.

What is claimed is:
 1. An integrated circuitry package for a multi-colorreplaceable print head cartridge, comprising: multiple units ofintegrated circuitry each to print a different color ink, each of theunits of integrated circuitry having a silicon print head die with anarray of nozzles for discharging a respective one of the different colorinks; a plurality of temperature sensors on each of the dies; an analogsense bus conductively connected to all of the temperature sensors; aprint controller contact; and a single external sensor pad conductivelyconnecting the bus to the contact.
 2. The integrated circuitry packageof claim 1, wherein the external sensor pad multiplexes signals tobetween the temperature sensors and the contact.
 3. The integratedcircuitry package of claim 1, wherein the temperature sensors on each ofthe units of integrated circuitry return a signal to the external sensorpad in response to an instruction for the unit to print.
 4. Theintegrated circuitry package of claim 1, wherein the external sensor padmultiplexes signals between the temperature sensors and the contact at afrequency of an integrated circuit print rate divided by a number of theplurality of temperature sensors.
 5. The integrated circuitry package ofclaim 1, wherein the temperature sensors provide a signal one after theother along a shared analog sense bus to the external sensor pad withoutrepeating until each of the temperatures sensors has provided thesignal.
 6. The integrated circuitry package of claim 1, wherein each oneof the temperature sensors is selected by changing a corresponding bitvalue.
 7. The integrated circuitry package of claim 1, wherein one ofthe temperature sensors on each die is located on an end region at anedge of a fluid feed hole and with a heating element located closer tothe edge of the fluid feed hole than to a second fluid feed hole.
 8. Theintegrated circuitry package of claim 7, wherein the heating element islocated on each die to raise the temperature on the end region to matcha temperature detected from a middle temperature sensor disposed in amiddle region of the die.
 9. A method for communicating data from areplaceable print head cartridge, comprising: sending a request for atemperature data response from a plurality of temperature sensorsdisposed in a plurality of temperature regions on an integratedcircuitry; and multiplexing responses from the plurality of temperaturesensors at an external sensor pad disposed on the integrated circuitry,the responses received on a shared, single lane analog bus.
 10. Themethod of claim 9, wherein: the integrated circuitry comprises a siliconprint die; and a first temperature sensor of the plurality oftemperature sensors is located on a first silicon print die and a secondtemperature sensor of the plurality of temperature sensors is located ona second silicon print die.